BlueShark v4.2

This product is not recommended for new design!

OMAP3530 and OMAP3525 high-performance, applications processors are based on the enhanced OMAP™ 3 architecture. The OMAP™ 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following:

  • Streaming video
  • 3D mobile gaming
  • Video conferencing
  • High-resolution still image

The device supports high-level operating systems (OSs), such as:

  • Linux
  • Android
  • Windows CE
  • QNX

This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products.

The following subsystems are part of the device:

  • Microprocessor unit (MPU) subsystem based on the ARM Cortex™-A8 microprocessor
  • IVA2.2 subsystem with a C64x+ digital signal processor (DSP) core
  • POWER SGX™ subsystem for 3D graphics acceleration to support display and gaming effects (3530 only)
  • Camera image signal processor (ISP) that supports multiple formats and interfacing options connected to a wide variety of image sensors
  • Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC/PAL video out.
  • Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals

The device also offers:

  • A comprehensive power and clock-management scheme that enables high-performance, low-power operation, and ultralow-power standby features. The device also supports SmartReflex™ adaptative voltage control. This power management technique for automatic control of the operating voltage of a module reduces the active power consumption.
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Processors:

  • DaVinciTM OMAP3530 Cortex-A8+DSP+3D
  • DaVinciTM OMAP3525 Cortex-A8+DSP
  • SitaraTM OMAP3515 Cortex-A8+3D
  • SitaraTM OMAP3503 Cortex-A8

Configuration:

  • DDR 256MB
  • NAND SLC 128MB-1GB
  • Commercial temperature: 0°С..+85°С
  • Extended temperature: -25°С..+85°С
  • Industrial temperature: -40°С..+85°С

Processors

  • OMAP3530 Cortex-A8 600MHz + DSP + 3D
  • OMAP3525 Cortex-A8 600MHz + DSP
  • OMAP3515 Cortex-A8 600MHz + 3D
  • OMAP3503 Cortex-A8 600MHz

Memory

  • mobile-DDR 128MB / 256MB
  • NAND SLC 128MB-1GB
  • EEPROM 1024B + 48bit EUI-48™

Intercconects

  • USB 2.0 High-speed On-the-Go
  • USB 2.0 high-speed host
  • 3x UART Rx/Tx+CTS/RTS
  • 2x I2C
  • McSPI1

Graphics

  • Video input port from CCD/CMOS
  • PowerVR SGX530 2D/3D graphics engine
  • 24bit TFT-LCD (WXGA)
  • OpenGL 1.1/2.0 and OpenVG 1.0 (DM3730/AM3715)

Extentions

  • SRAM, NOR, NAND, FRAM
  • 2x SD/MMC
  • McBSP1 / McBSP3
  • CMOS/CCD 8/12 bits

Ethernet

  • Physical Layer 10/100Base-T
  • Speed 10/100 Mbps, HP Auto MDIX
  • MAC globally unique

Electrical

  • Main power: 5VDC +/-10%
  • Power for UART3 and Ethernet: 3.3VDC +/-10%
  • Current 5V: 200mA typical
  • Current 3.3V: max 85mA (Ethernet TX/RX full)

Dimensions

  • Length: 43mm
  • Width: 67.7mm
  • Thickness (max): 5.2mm

Working temperature

  • Extended temperature: -25°С..+85°С
  • Industrial temperature: -40°С..+85°С

Storage temperature

  • -50°С..+125°С

OS support

  • Embedded Linux

Reference Manuals:

Baseboard Datasheet:

Baseboard Schematics:

OS support
Embedded Linux 2.6.37 – On-Line Documentation
Android – On-Line Documentation

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